http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109987572-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_88ee579014f7952c6631f88912ae467b |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00269 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 |
| filingDate | 2017-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82aeb55047e1da379373836aca9aa927 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84b7bf01d2571ce3e23c980ef771ccbf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a509f8e66c5247ec75bd56056dc00eb6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5a56a6a1b240bb6f5a1e8d6a34b9ddb |
| publicationDate | 2019-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-109987572-A |
| titleOfInvention | A kind of MEMS wafer class encapsulation structure and method |
| abstract | The present invention provides a kind of MEMS wafer class encapsulation structure and method, comprising: 1) provides wafer, form MEMS structure and pad in the crystal column surface；2) cap with the first deep chamber is provided, cap alignment is placed in the crystal column surface, so that MEMS structure is contained in the first deep chamber, and by cap and the wafer bonding；3) cap on pad is removed, forms connecting line in bond pad surface；4) plastic packaging layer is formed in crystal column surface, plastic packaging layer covers cap, connecting line and pad, then plastic packaging layer is thinned, to appear connecting line；5) re-wiring layer is formed in plastic packaging layer surface, re-wiring layer and connecting line are electrically connected；6) metal coupling is formed on re-wiring layer；7) it cuts, to obtain independent MEMS package structure.The present invention first forms vertical connecting line in bond pad surface, re-forms the plastic packaging layer of covering connecting line and cap, realizes effective encapsulation to MEMS structure, in this way can be to avoid traditional TSV packaging technology is used, and cost is greatly lowered. |
| priorityDate | 2017-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.