| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1f800348bf0e9b09a1313b44f2331c81 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2250-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-205 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-36 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-36 |
| filingDate |
2017-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ffd0581d7ff9532e13ef157af787f0e |
| publicationDate |
2019-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-109974903-A |
| titleOfInvention |
A kind of pliable pressure test board and preparation method thereof |
| abstract |
The invention discloses a kind of pliable pressure test boards and preparation method thereof; the pliable pressure test board includes the PET protective layer being arranged successively from top to bottom; the PDMS layer of thermochromic dye doping; the PDMS layer of silver nano-grain doping; the PDMS layer of graphene nanometer sheet doping; golden conduction plated film, PDMS support array and PET support substrate；The preparation method includes being prepared PDMS support array using PDMS layer of the spin coating method preparation comprising different doping components using silicon wafer mold and being prepared gold conduction plated film using the method for thermal evaporation deposition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111307107-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111307107-A |
| priorityDate |
2017-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |