| abstract |
A cleaning agent for wafers, comprising solid particles, surfactants, and chelating agents; the cleaning agent is a non-Newtonian fluid or a solid state between a solid state and a flowing liquid state, and the cleaning agent can be applied to single crystal or In the cleaning step after the cutting surface of the polycrystalline wafer is ground, the cleaning agent has higher surface cleaning efficiency, reduces the residue of solid particles and the suspending agent in the grinding abrasive, and improves the cleaning yield. |