| abstract |
The present disclosure provides a resin composition, a prepreg for a printed circuit, and a metal-clad laminate. The resin composition comprises: a silicon aryne resin; a cyanate ester compound; and a maleimide compound. By using the resin composition, the metal-clad laminate can be produced that has at least one of characteristics of low dielectric loss tangent, high heat resistance, low thermal expansion coefficient, and the like. |