| abstract |
The present invention provides a curable granular organosilicon composition which is excellent in hot meltability, handling workability such as overmolding, and curing properties, and which can form a cured product with excellent hardness and toughness at high temperatures ranging from room temperature to about 250° C. product, particles formed by molding the curable granular silicone composition, etc., and uses thereof. The curable granular silicone composition and its use are characterized in that the curable granular silicone composition contains (A) a softening point of 30° C. or higher, and has a hydrosilylation reactive group and/or a radical reactive group 100 parts by mass of hot-melt silicone particles of agglomerates; (B) 100 to 4000 parts by mass of inorganic fillers (fine particles); and (C) a curing agent, which can form an average linear expansion coefficient in the range of 25°C to 200°C by curing Below 30ppm/°C, the ratio of the storage elastic modulus (G'-50) at -50°C to the value of the storage elastic modulus ( G'250 ) at 250 °C: (G'- 50 /G' 250 ) in the range of 1/1 to 1/50 of the cured product. |