http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109749702-B
Outgoing Links
Predicate | Object |
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classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 |
filingDate | 2018-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2021-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2021-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-109749702-B |
titleOfInvention | Conductive adhesive for laminated photovoltaic module and preparation method thereof |
abstract | The invention provides a conductive adhesive for a laminated photovoltaic module, which comprises the following components: a resin matrix, conductive particles, and an organic diluent; the resin matrix comprises epoxy modified organic silicon resin accounting for 20-35% of the weight of the conductive adhesive, a latent curing agent accounting for 6-20% of the weight of the conductive adhesive, and a thixotropic agent accounting for 1-3% of the weight of the conductive adhesive; the conductive particles comprise micrometer flake silver powder accounting for 50-65% of the weight of the conductive adhesive and nanometer silver particles accounting for 3-10% of the weight of the conductive adhesive, and the apparent density of the micrometer flake silver powder is 0.5-1.7g/cm 3 The average particle size is 3-8 μm. The conductive adhesive has good conductivity, reliability and shear strength, and the preparation method has simple process and low cost. |
priorityDate | 2018-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.