http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109706453-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2018-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-109706453-B |
| titleOfInvention | Application of benzopyrazine compound in copper surface roughening and composition containing benzopyrazine compound for copper surface roughening |
| abstract | The invention relates to application of a benzopyrazine compound in roughening a copper surface and copper surface roughening containing the benzopyrazine compoundA chemical composition. Wherein the benzopyrazine compound has a structure shown as a formula (I) Wherein R is 1 、R 2 、R 3 、R 4 And R 5 Each independently selected from a hydrogen atom, a methyl group, a hydroxyl group, a carboxyl group or a nitro group; r 5 And R 6 Each independently selected from a hydrogen atom, a carboxyl group or a chlorine atom. The benzopyrazine compound and the composition for roughening the copper surface containing the benzopyrazine compound have the advantages of enabling the color of the copper surface before laser drilling to be uniform, enabling the specific surface area to be large and enabling the copper layer to be low in microetching amount, and can effectively improve the quality of a circuit board prepared from the benzopyrazine compound. |
| priorityDate | 2018-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.