| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_86bd0a90b6a6bb760ff3bd293fdcd45a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5399
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate |
2018-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78abcb85837f64da60c67615f7dca3d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb08b8ba0b8e5636d6b6623ffd6021d6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8de5b6eae22df942e69eac263ca4da7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20bd7996f543a8bbbaeda5cab0ed3b02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ce084c05dd49f97a974373e67a4ede1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a78c84457f514f9cb0eb3341a8b31fb9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_548e0b79bb4273ec6ffd17fef0df68d5 |
| publicationDate |
2019-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-109694545-A |
| titleOfInvention |
A halogen-free high heat-resistant resin composition for copper clad laminates |
| abstract |
The invention discloses a halogen-free high heat-resistance resin composition for copper clad laminates. Based on 100 parts by weight (PHR) of organic solids, the composition comprises the following main components: (a) a polystyrene-containing main chain benzene Poxazine resin 5-60PHR; (b) High heat-resistant epoxy resin 20-50PHR; (c) Other curing agent 5-30PHR; (d) Toughening resin 0.1-10PHR; (d) Phosphorus-containing flame retardant 10 -30PHR; (e) inorganic filler 40-150PHR; (d) curing accelerator 0.01-1PHR; (f) silane coupling agent 0.01-1PHR; (g) appropriate amount of solvent. And the copper-clad laminate prepared from the above composition has excellent dielectric properties, high glass transition temperature, low thermal expansion coefficient, high heat resistance, good flame retardancy and excellent PCB processing performance. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110421928-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110283428-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110218414-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111704857-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111704786-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110218414-B |
| priorityDate |
2018-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |