http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109679402-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-101 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0094 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-101 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2018-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-109679402-B |
| titleOfInvention | Hole plugging ink composition special for hole plugging and filling and printed circuit board |
| abstract | The invention relates to a hole-plugging ink composition special for filling holes and a printed circuit board, wherein the ink composition comprises a photocuring diluted alkali water developable resin and peroxide, the photocuring diluted alkali water developable resin contains carboxyl and unsaturated double bonds in molecules, and the weight of the peroxide accounts for 0.1-5.0% of the weight of the ink composition. The hole plugging ink solves the problem of performance defects caused by low double bond reaction rate and insufficient molecular crosslinking degree in the hole plugging ink by adding peroxide, and realizes excellent heat resistance, crack resistance and cavitation resistance of the hole plugging ink. |
| priorityDate | 2018-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 167.