| abstract |
Embodiments of bonded semiconductor structures and methods of making the same are disclosed. In an example, a semiconductor device includes a first semiconductor structure, a second semiconductor structure, and a bonding interface between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure includes a substrate, a first device layer disposed on the substrate, and a first bond disposed over the first device layer and including a first bond contact and a first bond alignment mark Floor. The second semiconductor structure includes a second device layer and a second bond layer disposed below the second device layer and including a second bond contact and a second bond alignment mark. aligning the first bond alignment mark with the second bond alignment mark at the bond interface such that the first bond contact and the second bond contact are aligned at the bond interface . |