| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-24 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2018-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-109628966-B |
| titleOfInvention |
Stable electroless copper plating compositions and methods for electroless copper plating on substrates |
| abstract |
Specific cysteine derivatives are added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions so that the plating activity of the electroless copper plating compositions is not impaired even when electroless plating is performed at lower plating temperatures and higher stabilizer and higher leaching catalyst concentrations. |
| priorityDate |
2017-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |