| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J23-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1607
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J37-16 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J23-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J35-0013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 |
| filingDate |
2014-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7a9fa531cccd690d972c181d759155e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15424e8a9ac2ee1be72291c28333dbad |
| publicationDate |
2019-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-109609932-A |
| titleOfInvention |
For electroless metallization plating rugged catalyst |
| abstract |
The present invention provides a kind of for electroless metallization plating rugged catalyst, specifically provides a kind of water-soluble catalytic agent solution, includes one or more reducing agents, the nanoparticle comprising one or more noble metals and one or more flavonoid glycosides and its hydrate.The water-soluble catalyst of the noble metal nano particles and Flavoneoid derivative stabilizer is used for the chemical plating of metal on nonconductive matrix bottom.Substrate includes printed circuit board. |
| priorityDate |
2013-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |