http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109576766-B

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
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filingDate 2018-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2020-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-109576766-B
titleOfInvention Preparation of nano TiO by electrophoresis-electrodeposition2Method for enhancing Sn-based micro-bumps
abstract A method for preparing nano TiO2 enhanced Sn-based micro-convex points by electrophoresis-electrodeposition belongs to the technical field of electronic packaging. The invention firstly adopts the solution of the following components to carry out electrophoresis on nano TiO 2 Film formation: 0.3-0.6 g/L, CTAB 0.1.1-0.5 g/L magnesium chloride, nano TiO 2 5-50 g/L of particles; and then carrying out electrodeposition on the micro-convex points by adopting a solution with the following components: 10-60 g/L stannous sulfate, 0.5-2 mol/L concentrated sulfuric acid, 2-10 g/L gelatin, 0.1-0.7 mol/L phenol and nano TiO 2 5-50 g/L, CTAB 0.1.1-0.5 g/L of the particles. Nano TiO in the micro salient point (the size of the salient point is between 20 and 200 mu m) prepared by the invention 2 Uniform particle distribution, smooth surface of salient point, compact microstructure, and nano TiO 2 The addition of (2) inhibits Intermetallic compound (IMC) Cu in micro-welding points in electronic packaging 6 Sn 5 The growth of (2) has very important significance for improving the reliability of the micro welding spots.
priorityDate 2018-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 41.