http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109575283-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1071 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate | 2018-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-109575283-B |
| titleOfInvention | Polyimide film, metal-clad laminate and circuit substrate |
| abstract | The present invention provides a polyimide film with suppressed warpage and no anisotropy of thermal expansion coefficients in the longitudinal direction and the width direction, and a polyimide film using the polyimide film that realizes high dimensional stability and accuracy Metal-clad laminates and circuit substrates. The polyimide film includes a single-layer or multi-layer polyimide layer, and satisfies: (a) the thickness is in the range of 3 μm or more and 50 μm or less; (b) the thermal expansion coefficient is 10 ppm/K or less; ( c) After conditioning at 23° C. and humidity of 50% for 20 hours, the 50 mm square polyimide film was left to stand still so that the convex surface of the central part of the polyimide film was in contact with the flat surface, and the average value of the floating amount of the four corners was set as the average value. When it is the average warpage amount, the average warpage amount is 10mm or less; (d) The difference between the thermal expansion coefficient (CTE-MD) in the length (MD) direction and the thermal expansion coefficient (CTE-TD) in the width (TD) direction is ±3ppm /K or less. |
| priorityDate | 2017-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 145.