| abstract |
To provide a curable resin composition for a printed wiring board, a dry film, a cured product, and a printed wiring board capable of obtaining a cured product having low thermal expansion and good adhesion to a metal conductor. The resin composition contains fine cellulose fibers obtained by modifying the carboxyl groups of the fine cellulose fibers having carboxyl groups with at least any one of an amine compound and a quaternary ammonium compound to hydrophobize, and a curable resin . The fine cellulose fibers having carboxyl groups have an average fiber diameter of 0.1 nm or more and 200 nm or less, an average fiber length of 600 nm or less, and an average aspect ratio of 1 or more and 200 or less. |