Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B9-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B9-045 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32724 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-106 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67248 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68721 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32642 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 |
filingDate |
2017-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2021-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2021-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-109563343-B |
titleOfInvention |
Resin composition, sheet using the same, laminate, power semiconductor device, plasma processing apparatus, and semiconductor manufacturing method |
abstract |
A resin composition containing: (A) a polyimide resin containing 60 mol % or more of a diamine having a structure represented by the following general formula (1) in all diamine residues residue; (B) thermosetting resin; and (C) thermally conductive filler containing 60 parts by volume relative to 100 parts by volume of the total of (A) polyimide resin, (B) thermosetting resin and (C) thermally conductive filler (C) Thermally conductive filler in parts by volume or more. Provided is a resin composition capable of obtaining a sheet having excellent heat resistance and thermal conductivity, low elastic modulus, and excellent thermal responsiveness. |
priorityDate |
2016-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |