http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109476840-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G63-6886 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B33-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C64-118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C64-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-286 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y30-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-7166 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y70-10 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C64-124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y10-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C67-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y70-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B33Y70-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C64-118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B33Y10-00 |
| filingDate | 2017-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-109476840-B |
| titleOfInvention | Soluble materials for 3D modeling |
| abstract | The soluble material for three-dimensional modeling of the present invention is a soluble material for three-dimensional modeling that is used as a material for a support for supporting a three-dimensional object when a three-dimensional object is produced by a 3D printer of a thermal fusion lamination method, and the soluble material for three-dimensional modeling contains polyamide Resin, the above-mentioned polyamide resin contains: a hydrophilic monomer unit A having a hydrophilic group, a hydrophobic dicarboxylic acid monomer unit B, and a hydrophobic diamine monomer unit C, and the above-mentioned polyamide resin The ratio of the hydrophilic monomer unit A to the total of all monomer units is 2.5 mol % or more and less than 13.5 mol %. According to the soluble material for three-dimensional modeling of the present invention, it is suitable for the production of three-dimensional objects by the FDM method, has moisture absorption resistance, has a high dissolution rate in neutral water, and can be quickly removed from a three-dimensional object precursor without using a strong alkaline aqueous solution. A soluble material for three-dimensional modeling of supports. |
| priorityDate | 2016-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 123.