http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109438631-B

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y70-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-105
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B33Y70-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F222-20
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filingDate 2018-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-109438631-B
titleOfInvention High-precision and high-thermal-deformation-temperature stereolithography 3D printing photosensitive resin and preparation method thereof
abstract The invention belongs to the field of 3D printing rapid prototyping and manufacturing, and particularly relates to a high-precision and high-thermal-deformation-temperature stereolithography 3D printing photosensitive resin and a preparation method thereof. The composite material consists of the following raw materials in percentage by weight: 5 to 95% of bis [ (3-ethyl-3-methoxyoxetane) propyl ] diphenylsilane; 3-80% of an acrylate prepolymer; 0-40% of an acrylate diluent; 0.5-10% of cationic initiator; 0.5 to 10% of a radical initiator. The photosensitive resin prepared by the invention has good photosensitivity, high forming precision and high thermal deformation temperature, and can be directly used for manufacturing parts or dies with any complex shapes and high precision and high thermal deformation.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023107567-A1
priorityDate 2018-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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