Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2029-7858 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3211 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-665 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66545 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-535 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76805 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76889 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76897 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76895 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66795 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02186 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28518 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-41791 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32135 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66636 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0847 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7853 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7851 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76829 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7855 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336 |
filingDate |
2017-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2022-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2022-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-109427898-B |
titleOfInvention |
Method of forming a semiconductor device |
abstract |
Embodiments of the present invention provide a method of forming a semiconductor device including forming source/drain regions, and performing selective deposition in a vacuum chamber or vacuum cluster system to form a metal silicide on the source/drain regions layer, and a metal layer is formed on the dielectric regions adjacent to the source/drain regions. The method also includes selectively etching the metal layer in the vacuum chamber and selectively forming a metal nitride layer on the metal silicide layer. The selective formation of the metal nitride layer is performed in a vacuum chamber or vacuum cluster system without breaking the vacuum. Embodiments of the present invention also provide two other methods for forming semiconductor devices. |
priorityDate |
2017-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |