http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109427692-B

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filingDate 2017-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2020-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-109427692-B
titleOfInvention Encapsulation film and its application
abstract The invention discloses an encapsulation film and a preparation method and application thereof. The encapsulation film of the present invention includes ceramic and metal filled between ceramic grains. The encapsulation film of the invention has excellent water-oxygen barrier function and excellent thermal conductivity, ensures the stability of the electrochemical performance of the encapsulated electronic components, and prolongs the working life of the electronic components. The preparation method ensures the structure stability of the encapsulation film and the excellent water and oxygen barrier properties. Its applications include applications in electronic devices.
priorityDate 2017-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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