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filingDate 2018-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2022-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-109427595-B
titleOfInvention Fin field effect transistor device and method of forming the same
abstract A fin field effect transistor device and a method for forming the same, the method comprising: forming a fin over a substrate; forming an isolation region near the fin; forming a dummy gate structure over the fin; and using a first etching process The fins adjacent to the dummy gate structure are etched back to form a first recess; the first recess is reshaped by a second etching process to form the reshaped first recess, wherein the second etching process etches adjacent to the first recess. The top half of the fin at the top of a recess is etched more than the lower half of the fin adjacent to the bottom of the first recess by the second etch process, and grows epitaxially in the reshaped first recess source/drain regions. The step of reshaping the first recess includes performing an oxide etch process, wherein the oxide etch process forms a layer of porous material within the first recess.
priorityDate 2017-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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