| abstract |
The present invention provides a resin composition and the like in which, even if a large amount of an inorganic filler is used, it is possible to obtain a balance that can maintain adhesion with a conductor layer after an environmental test in a high-temperature and high-humidity environment Good cure. A resin composition, which is a resin composition comprising (A) an epoxy resin, (B) a benzoxazine compound and (C) an inorganic filler, wherein the (B) component is composed of the following general formula (B- 1) shows that content of (C)component is 67 mass % or more when the non-volatile matter in a resin composition is 100 mass %. In formula (B-1), R 1 represents an n-valent group containing an oxygen atom, R 2 each independently represents a halogen atom, an alkyl group or an aryl group, n represents an integer of 2 to 4, and m represents an integer of 0 to 4 . |