| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a8a9982b1666c54b5bf02d6c944891e4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68359
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0143
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-013 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76897
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30604
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76251
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-268
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31111 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
| filingDate |
2017-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abcd8b0e07f77658741f032866e7a2ac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c3254b73334a2f3f42a92b41ef0494c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f1e9066a0140a601fe8a27e1431bd38 |
| publicationDate |
2019-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-109417031-A |
| titleOfInvention |
Inorganic wafer with through holes attached to semiconductor wafer |
| abstract |
One process includes bonding a semiconductor wafer to an inorganic wafer. Semiconductor wafers are opaque to wavelengths of light that are transparent to inorganic wafers. After bonding, damage tracks are formed in the inorganic wafer using a laser at the emission wavelength. Through etching, damage tracks in the inorganic wafer are enlarged to form holes through the inorganic wafer. The holes terminate at the interface between the semiconductor wafer and the inorganic wafer. Also provided is an article comprising a semiconductor wafer bonded to an inorganic wafer. Semiconductor wafers are opaque to wavelengths of light that are transparent to inorganic wafers. The inorganic wafer has holes formed through the inorganic wafer. The holes terminate at the interface between the semiconductor wafer and the inorganic wafer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113784912-A |
| priorityDate |
2016-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |