| abstract |
The application provides a kind of novel curable composition, it is the two-liquid type solidification compound for having used epoxy resin and the organic polymer with bridging property silicon substrate, without solidification delay or not the viscosity of host agent rise, deterioration of host agents such as gelation or precipitation of insoluble matter etc., storage stability it is excellent.Additionally, it is provided even if one kind in order to improve deep curability adds water, storage stability also excellent novel curable composition.The host agent of two-liquid type composition epoxy resin contains: (A) epoxy resin；(B) with the compound of Si-F key；And (C) does not have the alkoxy silane selected from least one of the group being made of primary amino group, secondary amino group and sulfydryl group, in addition, the curing agent of two-liquid type composition epoxy resin contains: (D) has the organic polymer of bridging property silicon substrate；And (E) tertiary amine compound. |