| abstract |
The present invention provides a curable formulation comprising: a metal aprotic organosilane oxide compound of formula (I): { R 1 ‑Si(R 2 )(R 3 )‑[O‑Si(R 4 )(R 5 )] m ‑O} n‑ M 1 (←L) o (X 1 ) p (I) wherein M 1 Is metal atom Al, Ce, Fe, Sn, Ti, V, or Zr; a polymerizable organosilicon compound; an organosilicon crosslinking agent for crosslinking the polymerizable organosilicon compound; and a silicon-based adhesion promoter. The present invention also includes a cured product obtained by curing the curable formulation; an article comprising or prepared from a curable formulation or cured product; and methods of making and using the foregoing. The cured product may be free standing or disposed on a substrate. |