http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109402436-A

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filingDate 2018-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55e3054095b319ae9cb26af655799b67
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publicationDate 2019-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-109402436-A
titleOfInvention A kind of preparation method of electronic package material
abstract The present invention provides a kind of preparation methods of electronic package material, diamond particles are boiled into oil removing with degreaser first, with activator, by treated, diamond particles boil activation again, then after the diamond particles after activation being mixed with plating powder, it is heated in vacuum environment, with copper plating bath, to treated, diamond particles carry out copper facing again, finally by the diamond particles embedded type film of processing, it is put into graphite sleeve, the copper billet that volume fraction is 30~70% is placed in the top of graphite sleeve, heating pressurization and pressure maintaining after vacuumizing.Method strong operability provided by the present invention, simple process, the material thermal conductivity being prepared are up to 611W/mK, and thermal expansion coefficient is down to 8.8 × 10 ‑6 /K。
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110373660-A
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priorityDate 2018-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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