http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109399552-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5f2cbd5d6076ed5c4eb4550dd266705b http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_48df6bc4ebf937c660e36d97dec66663 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0207 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-0069 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 |
| filingDate | 2018-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e19fca0bb890b074572166f83931daac http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3984c6c44a5af3e93ffec79626f76471 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_efdf29bc7012cdf248fafaf0f1c6bfd7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a28b08c835c96ea2ef455cab815e5701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_627a3c03b581aa647646063aa67d7a62 |
| publicationDate | 2019-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-109399552-A |
| titleOfInvention | Micro-electromechanical system infrared detector and manufacturing method thereof |
| abstract | The invention provides an infrared detector for a micro-electromechanical system, comprising a substrate with at least two vertical conductive regions, a heat-sensitive device relatively fixed to the substrate and configured with at least two electrodes, the number of which is the same as the number of electrodes, and the electrodes are electrically connected to The conductive lead of the vertical conductive area; wherein, the substrate is provided with a thermal insulating layer, and the thermal insulating layer is located at the projection surface of the thermally sensitive device on the substrate. The invention provides the structure of a MEMS infrared detector. The thermally sensitive device is used for receiving infrared radiation signals, outputting electrical induction signals, and orienting the upper surface of the thermally sensitive device toward the area to be detected, on the thermal insulating layer at the lower part of the thermally sensitive device, and at the bottom of the thermally sensitive device. The lower part of the thermal sensitive device is provided with a lead structure to improve the measurement accuracy. Based on this, the present invention also provides a method for manufacturing an infrared detector of a micro-electromechanical system. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021132462-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110577186-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021046992-A1 |
| priorityDate | 2018-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.