http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109390437-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-156 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0093 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7806 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-167 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-15 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
| filingDate | 2017-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-109390437-B |
| titleOfInvention | Micro light-emitting diode device and manufacturing method thereof |
| abstract | The invention provides a micro light-emitting diode device and a manufacturing method thereof. A connection layer and a plurality of epitaxial structures are formed on a substrate. A first bonding pad is formed on each epitaxial structure. A first adhesion layer is formed on the connection layer, and the first adhesion layer covers the epitaxial structures and the first bonding pads. The first substrate is connected to the first adhesive layer. And removing the substrate, and connecting the second substrate to the connecting layer through the second adhesion layer. The first substrate and the first adhesion layer are removed. The connecting layer between any two adjacent epitaxial structures is partially removed to form a plurality of connecting portions separated from each other. Each connecting part is connected with the corresponding epitaxial structure, and the side edge of each connecting part protrudes out of the side wall surface of the corresponding epitaxial structure. |
| priorityDate | 2017-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.