http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109355649-B
Outgoing Links
Predicate | Object |
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classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-63 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-52 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-63 |
filingDate | 2018-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2020-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2020-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-109355649-B |
titleOfInvention | PCB copper surface oxidant and preparation method thereof |
abstract | The invention discloses a PCB copper surface oxidant, which consists of a component A and a component B, wherein the mass ratio of the component A to the component B is 2: 1-2, wherein the component A comprises the following raw materials in percentage by mass: 30-50% of hydrogen peroxide, 1-10% of copper surface inhibitor, 1-5% of surfactant and 35-68% of deionized water; the component B comprises the following raw materials in percentage by mass: 30-50% of ammonia water, 9.5-19.9% of salt, 0.1-0.5% of taste masking agent and 30-60% of deionized water. The invention can oxidize the copper surface circuit of the circuit board, generate a compact oxidation complex layer on the copper surface circuit of the circuit board, the oxidation complex layer can be removed by simple acid cleaning, thus the copper surface oxidation is carried out on the circuit board by using the copper surface oxidant before black hole forming, micro-etching is not needed after black hole forming, thus the copper substrate of the circuit board can not be corroded, and the application range of the black hole forming process is greatly widened. |
priorityDate | 2018-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.