| abstract |
The invention discloses an ultraviolet hybrid curing packaging adhesive composition which comprises organic silicon modified epoxy acrylic resin, a diluent, a photoinitiator, a thermal curing agent, a heat-conducting non-conductive filler, a coupling agent and the like, wherein the heat-conducting non-conductive filler comprises surface graft modified graphene oxide/graphite. The composition has adhesive strength of more than 1.3MPa, heat resistance temperature of more than 190 deg.C, heat conductivity of more than 1.21W/m.K, and volume resistivity of more than 10 13 Omega m can meet the packaging requirements of some components in the electronic industry, and can be applied to the bonding and fixing of heat dissipation devices and the like. |