| abstract |
The invention provides a thermosetting resin composition, and a prepreg, a laminated board and a high-frequency circuit substrate containing the thermosetting resin composition, wherein the thermosetting resin composition comprises the following components: 12-50 parts of cyanate ester resin; 30-60 parts of epoxy resin; 10-28 parts of biphenyl phenolic resin. The prepreg and the copper-clad plate prepared from the thermosetting resin composition have high glass transition temperature, excellent dielectric property, low water absorption, high heat resistance, high peel strength and interlayer adhesion and good process processability. |