http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109327968-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0214 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2018-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-109327968-B |
| titleOfInvention | Processing method for improving layering of dense heat dissipation hole region |
| abstract | The invention discloses a processing method for improving the layering of dense heat dissipation hole regions, which comprises the following steps: firstly, adding ThermalPAD on each core board of the multilayer circuit board in a large copper surface area corresponding to the dense heat dissipation holes, wherein the width of a copper-free area dug in the ThermalPAD area is 5-10 mil; after the core board is processed, laminating and synthesizing a multilayer circuit board according to the core board; the circuit board is drilled, and in order to increase the distance from the hole wall to reduce the layering risk pair on the premise of not changing the hole density, a drill point with a small diameter is selected for processing; and after drilling, carrying out chemical copper and electro-coppering processing on the drilled hole to realize hole wall metallization. Compared with the traditional scheme that the inner layer of the heat dissipation hole area is designed into a large copper surface, and the area is always a layered high-risk area, the method has the advantages that the heat dissipation function is not influenced, and the layering risk can be reduced by optimizing the graphic design of the inner layer, adjusting the hole diameter of the drilled hole and increasing the non-metallized holes. |
| priorityDate | 2018-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.