http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109293957-B

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2361-22
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G12-08
filingDate 2018-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2020-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-109293957-B
titleOfInvention COFs film material with ultra-low dielectric constant
abstract The invention relates to a COFs film material with an ultralow dielectric constant, belonging to the field of dielectric materials. The film material is a novel film material with high crystallinity, uniform thickness, porosity, flexibility and humidity resistance and ultralow dielectric constant, which is formed by the reaction between the interfaces of two immiscible solutions, and the dielectric constant of the film material can be as low as 1.19; and the performance and the thickness of the two solutions can be regulated and controlled by regulating and controlling the components and the concentrations of the two solutions. Compared with the traditional inorganic dielectric material and organic high molecular polymer dielectric material, the film material disclosed by the invention has the advantages of good stability and low dielectric constant of the inorganic dielectric material, and also has the advantages of good flexibility, easy processability, good humidity resistance and the like, and the system of the dielectric material with low dielectric constant is expanded.
priorityDate 2018-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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