| abstract |
The invention discloses a chip stacking structure and a manufacturing method of the die stacking structure. The chip stack structure includes a first chip and a second chip. The second chip is on the first chip. The first chip includes a first substrate, a first interconnect structure, a first pad and a first contact conductor. The first interconnect structure is on the first surface of the first substrate. The first pad is located on the first interconnect structure. The first contact conductor is located in the first substrate and exposed to a second surface of the first substrate opposite the first surface. The second chip includes a second substrate, a second interconnect structure, a second pad, and a second contact conductor. The second interconnect structure is on the second substrate. The second pad is located on the second interconnect structure. The second contact conductor is located in the second substrate, wherein the first contact conductor is in direct physical contact with the second pad. The chip stacking structure and the manufacturing method of the die stacking structure of the present invention are simple in fabrication process and have high fabrication process yield. |