http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109280919-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213 |
| filingDate | 2017-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-109280919-B |
| titleOfInvention | Etchant composition for copper-containing metal |
| abstract | The invention discloses an etchant composition for copper-containing metal, which comprises 1 wt% to 25 wt% of oxidant, 1 wt% to 30 wt% of acid, 0.1 wt% to 13 wt% of copper protective agent, 0.5ppm to 120ppm of chloride ion, 0.1 wt% to 4 wt% of copper activator and the balance of water. The etchant composition can effectively etch and remove the copper seed crystal layer used in the redistribution circuit process in wafer-level chip packaging, and can greatly reduce the line width loss of the redistribution circuit layer. |
| priorityDate | 2017-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 62.