| abstract |
The invention discloses an etchant composition containing a silver composite film, which has a main composition of 4 to 9% of nitric acid, 45 to 55% of phosphoric acid, 8 to 15% of acetic acid, 0.1 to 5% by weight. Inorganic ammonium salt and 20-30% water, further including C4 to C6 aliphatic hydroxy acid in a weight percentage of not more than 5%, and an aliphatic hydroxy acid having a hydroxyl group and a hydroxyl group at the alpha carbon atom bonded to the carboxyl group in the structural formula Substituent. In the acid etching system, based on the same inorganic acid concentration, the addition of α-hydroxy acid helps to reduce the etching speed of the silver layer, reduces the etching rate difference of the etching solution composition to silver and ITO, and improves the top ITO collapse, the substrate aluminum The silver surface of the wiring surface has a small amount of adsorption, which satisfies the requirements of the later coating, and the yield of the etched product is improved. The invention also discloses an etching method for a silver-containing composite film etching solution composition. |