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filingDate 2016-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2020-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-109232891-B
titleOfInvention Prepolymer for low-dielectric bismaleimide resin system
abstract The invention discloses a prepolymer for a low dielectric bismaleimide resin system, which is prepared by taking bismaleimide, an allyl compound, mesoporous silica and polyphenylene oxide as raw materials, coating the mesoporous silica with the polyphenylene oxide, and applying the mesoporous silica to the bismaleimide resin system; the method disclosed by the invention has the characteristics of simple process, wide applicability and the like, and the prepared material has wide application potential in the fields of aviation, aerospace and electronics.
priorityDate 2016-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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