| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-302 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3432
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J179-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-00 |
| filingDate |
2017-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-109219635-B |
| titleOfInvention |
Curable adhesive compound and reactive adhesive tape based thereon |
| abstract |
The invention relates to a heat-curable adhesive compound consisting of the following components: (A) 4.9-34.9 wt.% (relative to the total amount of the curable adhesive compound) of an epoxy-functional (co) polymer having a weight average molecular weight in the range of 5000-200000 g/mol, based on more than 30-100 wt.%, preferably 50-100 wt.% (relative to the total amount of monomers on which the epoxy-functional (co) polymer is based) of at least one type of (meth) acrylic (co) monomer (a) functionalized with epoxy groups, (B) 0.1-5 wt.% (relative to the total amount of the curable adhesive compound) of at least one heat-activatable curing agent for cationic curing of epoxides, (C) 65-95 wt.% (relative to the total amount of the curable adhesive compound) of at least one type of matrix polymer as film former, (D) optionally from 0 wt% to 30 wt% of additional ingredients. |
| priorityDate |
2016-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |