| abstract |
Bismaleimide (BMI) exhibits superior heat resistance (high Tg and high thermal decomposition resistance) compared to epoxy resins and phenolic resins, and therefore, in recent years, it has been studied not only for use in electronic materials, but also for use in electronic materials. Attention is drawn as a resin material for next-generation devices represented by SiC power semiconductors. As described above, although conventional BMIs are known as high heat-resistant resins, resins having higher heat-resistance are required for advanced material applications and the like. Therefore, the objective of this invention is to provide the novel maleimide compound which is more excellent in heat resistance. A maleimide compound containing a substituted or unsubstituted allyl group, characterized in that it has a structure containing three or more benzene rings, one or more groups containing a substituted or unsubstituted allyl group, A compound further having one or more maleimide groups. |