http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109216290-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ce622eaf11f47c660916fec28a362060 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N50-01 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L43-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367 |
| filingDate | 2018-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_595ed1d81e49347353dbd30487d29b38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f76734de86fc5cd9f765598a3f13646 |
| publicationDate | 2019-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-109216290-A |
| titleOfInvention | A packaging and testing system for semiconductor indium antimonide Hall devices |
| abstract | The invention discloses a packaging and testing system for a semiconductor indium antimonide Hall device, comprising a first plastic packaging body and a second plastic packaging body, a main channel is arranged between the first plastic packaging body and the second plastic packaging body, and the first plastic packaging body and the second plastic packaging body are provided with a main channel. A row of first holes is formed through the upper and lower end surfaces of a plastic body and a second plastic body close to the two sides. The first holes in the two rows are arranged parallel to each other. The first plastic body and the second plastic body are close to two The upper and lower end surfaces of each side are provided with a row of second holes, the two rows of the first holes and the corresponding two rows of the second holes are linearly distributed, and the first holes and the second holes of the same row are arranged in a linear pattern. Dislocation distribution, several copper-based element groups are installed on the upper end surfaces of the first plastic body and the second plastic body. The invention relates to a packaging and testing system for semiconductor indium antimonide Hall devices. The design adopts an 8-row automatic charging method. , to ensure the consistency of the product, the design of automatic mold one mold 2 cavity 576Pcs, automatic mold mode 50 seconds, epoxy materials, this design saves 80% of the material waste compared to the traditional. |
| priorityDate | 2018-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.