http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109177382-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-302 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-10 |
| filingDate | 2018-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-109177382-B |
| titleOfInvention | Flexible copper-clad plate with high heat conductivity and high heat dissipation performance and preparation method thereof |
| abstract | The invention discloses a high-heat-conductivity high-heat-dissipation flexible copper clad laminate, which comprises a copper foil, and a heat-conducting insulating layer and a heat-conducting polyetherimide layer which are sequentially arranged on the copper foil, wherein the heat-conducting insulating layer is composed of the following raw materials in parts by weight: 40-70 parts of nitrile rubber modified epoxy resin, 8-15 parts of boron nitride, 8-15 parts of silicon nitride, 30-45 parts of aluminum oxide and 3-8 parts of dicyandiamide; the heat-conducting polyetherimide layer is composed of the following raw materials in parts by weight: 90-120 parts of polyetherimide, 15-30 parts of graphene, 20-40 parts of silicon carbide, 3-6 parts of tungsten dioxide and 5-10 parts of 3-aminopyridine. The copper-clad plate prepared by the invention has good heat dissipation and high heat conductivity coefficient, and can reach 8-10W/m.K. |
| priorityDate | 2018-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.