Predicate |
Object |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-467 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
filingDate |
2017-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2021-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2021-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-109156084-B |
titleOfInvention |
Method for manufacturing insulating layer and multilayer printed circuit board |
abstract |
The present invention relates to a method for manufacturing an insulating layer, which can be manufactured in a faster and simpler manner, can improve process efficiency, can prevent physical damage to the insulating layer, and can easily adjust layer thickness; and a method of manufacturing a multilayer printed circuit board using the insulating layer obtained by the method of manufacturing an insulating layer. |
priorityDate |
2016-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |