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Outgoing Links

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
filingDate 2016-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-109153907-B
titleOfInvention CMP slurry composition and method for polishing organic film using the same
abstract The present invention relates to a CMP slurry composition and a method for polishing an organic film using the same, the CMP slurry composition comprising: an oxidizing agent comprising an iron-containing component; an organic acid having one carboxyl group; and water. The CMP slurry composition of the present invention does not contain abrasive particles, thereby effectively preventing over-polishing caused by the abrasive particles and/or scratching occurring when an organic film is polished.
priorityDate 2015-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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