http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109153907-B
Outgoing Links
Predicate | Object |
---|---|
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-306 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
filingDate | 2016-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2021-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2021-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-109153907-B |
titleOfInvention | CMP slurry composition and method for polishing organic film using the same |
abstract | The present invention relates to a CMP slurry composition and a method for polishing an organic film using the same, the CMP slurry composition comprising: an oxidizing agent comprising an iron-containing component; an organic acid having one carboxyl group; and water. The CMP slurry composition of the present invention does not contain abrasive particles, thereby effectively preventing over-polishing caused by the abrasive particles and/or scratching occurring when an organic film is polished. |
priorityDate | 2015-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 72.