Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1476752f2420c8f8eb53464cf7fc922b |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05547 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13076 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0603 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05558 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0508 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05084 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05086 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-034 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1403 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0346 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0361 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05572 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11849 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3171 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-06 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
filingDate |
2018-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae9c07c2be0aeaf383beac69d4b0d3ca http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fbad93b8444212aa8439262f3d591681 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53523496f6e7319c2bda5671f6043eb3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fc3149d04ae2b26f3ca27ff2be920dc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ec9402ed92634053e82c2a208bce711 |
publicationDate |
2019-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-109148409-A |
titleOfInvention |
semiconductor chip |
abstract |
The present invention provides a semiconductor chip in which bump heights are aligned independently of the control of the amount of solder applied. The semiconductor chip includes: a semiconductor substrate having a main surface; a first electrode formed on the main surface of the semiconductor substrate; a second electrode formed on the main surface of the semiconductor substrate; and a first insulating layer formed on a part of the first electrode a first bump formed on another part of the first electrode and the first insulating layer and electrically connected to the first electrode; and a second bump formed on the second electrode and on the main surface of the semiconductor substrate It has an area larger than that of the first bump in plan view, and the distance from the main surface of the semiconductor substrate to the upper surface of the first bump in the direction normal to the main surface of the semiconductor substrate is adjusted by the first insulating layer. |
priorityDate |
2017-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |