| abstract |
The invention discloses a resin composition comprising 30 to 90 parts by weight of maleimide resin and 15 to 60 parts by weight of benzoxazine resin. The aforementioned resin composition can be made into various articles, such as prepregs, copper foil-attached prepregs, resin films, copper foil-attached resin films, laminates, or printed circuit boards, and satisfies the high peel strength, high moisture absorption expected of articles At least one, more or all of the characteristics of post heat resistance, high glass transition temperature, low thermal expansion rate, high heat resistance, low dielectric constant and low dielectric loss. |