| abstract |
An integrated multilayer assembly (100, 200, 300) for an electronic device, comprising a first substrate film (106) configured to accommodate electrical features on at least a first side thereof, the first substrate film having a first side and a substantially opposite second side, a second substrate film (202) configured to accommodate electrical features on at least a first side thereof, the second substrate film having a first side and substantially The opposite second side, the first sides of the first and second substrate films are configured to face each other, the at least one electrical feature (214B) on the first side of the first substrate film, the At least one other electrical feature (214A) on the first side, and the molded plastic layer (204) between the first and second substrate films at least partially embed the electrical feature on their first side. A related fabrication method is proposed. |