| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6677
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4697
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4807
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q1-2283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q1-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q9-0414
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4629
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q21-0093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4667
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q21-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q21-0087 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B7-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01Q21-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40 |
| filingDate |
2017-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2020-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-109074900-B |
| titleOfInvention |
High frequency multilayer interconnection substrate and method of making the same |
| abstract |
[Problem] In order to achieve high reliability and high functionality while suppressing characteristic changes in multilayer interconnect substrates used in microwave or millimeter wave bands integrated with antennas. [Solution Device] A high-frequency multilayer substrate having an antenna element formed on a surface. The high-frequency multilayer substrate has an intermediate substrate. The intermediate substrate consists of a low temperature co-fired glass-ceramic substrate, and has an intermediate insulating layer consisting of glass-ceramic and an inner conductor formed between these intermediate insulating layers. A surface insulating layer composed of an organic material having a dielectric constant lower than that of the glass-ceramic material is stacked on the surface of the intermediate substrate. The outer via conductors penetrating the surface insulating layer are configured of sintered metal that forms a metallic bond with the wiring conductors in the substrate. The outer via conductors are formed while the glass-ceramic multilayer substrate is sintered. |
| priorityDate |
2016-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |