| abstract |
The present invention provides the following polyamide-imide film which maintains transparency and has significantly improved mechanical properties and heat resistance. The above-mentioned polyamide-imide is excellent in transparency, heat resistance, mechanical strength and flexibility, and can be used as a substrate for a device, a cover substrate for a display, an optical film, an IC (integrated circuit, integrated circuit) package, an adhesive film ( Adhesive film), multilayer FRC (flexible printed circuit, flexible printed circuit), adhesive tape, touch panel, protective film for optical discs, etc. |