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filingDate 2018-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2018-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-109037056-A
titleOfInvention Method of patterning a power metallization layer and method for processing an electronic device
abstract Methods of patterning power metallization layers and methods for processing electronic devices are disclosed. According to various embodiments, a method (100) for processing an electronic device may include forming a patterned hardmask layer (206p) over a power metallization layer (202), the patterned hardmask layer (206p) exposing at least one surface region (202s) of the power metallization layer (202); and at least one surface region (202s) of the power metallization layer (202) exposed by wet etching (220) The power metallization layer (202) is patterned.
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