http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109003961-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5386 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 |
| filingDate | 2018-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-109003961-B |
| titleOfInvention | A 3D system integration structure and its manufacturing method |
| abstract | The invention discloses a 3D system integration structure, comprising: an adapter board; a first through-silicon hole arranged on the front side of the adapter board; a second through-silicon hole arranged on the front side of the adapter board; the cavity on the back of the transfer board; the first re-distribution wiring layer and the pad are arranged on the bottom surface of the cavity, the first re-distribution wiring layer and the pad are electrically connected to the first through silicon via; A first chip in the cavity, the first chip is electrically connected to the first re-distribution wiring layer and pads; a plastic encapsulation filling layer; a second chip arranged on the back of the interposer board, the second chip is electrically connected to the second through silicon via; a second redistribution wiring layer arranged on the front side of the interposer board; and A soldering structure is provided on the front surface of the adapter board, and the soldering structure is electrically connected to the second redistribution wiring layer. |
| priorityDate | 2018-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123 |
Total number of triples: 15.